Apparatus and method for wire cutting glass-ceramic wafers

Details Apparatus and method for wire cutting glass-ceramic wafers Apparatus and method for wire cutting glass-ceramic wafers

1995-06-06

1996-10-15

Meislin, D. S.

Stone working

Sawing

125 1601, 125 1602, 492 39, 492 45, 269 47, B28D 102

Patent

active

055644090

ABSTRACT:
The present invention relates to an apparatus for cutting a mass of material which includes an elongate wire, a first drive for moving the cutting wire along its length through a cutting location, a rotating mass holder for holding and rotating a longitudinally-extending mass of material about its longitudinal axis, and a second drive. The second drive advances the mass holder and/or the wire toward one another to orient the longitudinal axis of the mass of material at the cutting location in a position perpendicular to the wire to cut the mass of material. Other aspects of the invention include a method of cutting, the mass holder per se.

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