Apparatus and method for warpage compensation of a display...

Details Apparatus and method for warpage compensation of a display... Apparatus and method for warpage compensation of a display...

2007-02-06

2007-02-06

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S840000, C029S842000, C029S843000

Reexamination Certificate

active

10841350

ABSTRACT:
An apparatus and method for warpage compensation of a display panel substrate assembly are described. A method and apparatus for warpage compensation of a display panel substrate assembly are described. In one embodiment, the method includes the selection of a substrate having a substrate warpage level exceeding a warpage tolerance level. Once selected, a plurality of conductive bumps are formed over an area of the selected substrate. Once formed, a thermal process is applied to the plurality of conductive bumps to obtain a virtual plane over the area of the selected substrate have a coplanarity level below a coplanarity specification level. As such, utilizing embodiments of the present invention, lower cost substrates with substandard warpage levels may be utilized to form OLED panel substrate assemblies when compensated utilizing embodiments of the present invention.

REFERENCES:
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patent: 5971253 (1999-10-01), Gilleo et al.
patent: 6094138 (2000-07-01), Eberhardt et al.
patent: 6234373 (2001-05-01), Wark
patent: 6464124 (2002-10-01), Wark
patent: 6642652 (2003-11-01), Collins, III et al.

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