Apparatus and method for vapor phase solder reflow

Metal fusion bonding – Process – With protecting of work or filler or applying flux

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2281801, B23K 3102, B23K 3538

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active

045807167

ABSTRACT:
A solder reflow process including vaporized fluorinated organic liquid such as FC-70 is dehumidified by pressurizing the vapor chamber with dry nitrogen and blowing the dry nitrogen against the conveyor belt and article to be soldered as they pass through the inlet throat.

REFERENCES:
patent: 2438721 (1948-03-01), Spencer
patent: 3621550 (1981-11-01), Colestock
patent: 3882596 (1975-05-01), Kendziora et al.
patent: 4231508 (1980-11-01), Wagner
patent: 4389797 (1983-06-01), Spigarelli et al.
patent: 4436242 (1984-03-01), Shisler et al.
"Chemical and Environmental Aspects of Condensation Reflow Soldering," by L. J. Turbini et al., Western Electric, Engineering Research Center, PO Box 900, Princeton, NJ 08540.
HTC Model IL-12 Operator's Manual, pp. 1-8; 2-3; 2-7; 2-11; and 5-12.

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