Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent
1984-10-17
1986-04-08
Lin, Kuang Y.
Metal fusion bonding
Process
With protecting of work or filler or applying flux
2281801, B23K 3102, B23K 3538
Patent
active
045807167
ABSTRACT:
A solder reflow process including vaporized fluorinated organic liquid such as FC-70 is dehumidified by pressurizing the vapor chamber with dry nitrogen and blowing the dry nitrogen against the conveyor belt and article to be soldered as they pass through the inlet throat.
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patent: 3621550 (1981-11-01), Colestock
patent: 3882596 (1975-05-01), Kendziora et al.
patent: 4231508 (1980-11-01), Wagner
patent: 4389797 (1983-06-01), Spigarelli et al.
patent: 4436242 (1984-03-01), Shisler et al.
"Chemical and Environmental Aspects of Condensation Reflow Soldering," by L. J. Turbini et al., Western Electric, Engineering Research Center, PO Box 900, Princeton, NJ 08540.
HTC Model IL-12 Operator's Manual, pp. 1-8; 2-3; 2-7; 2-11; and 5-12.
Barresi Anthony J.
Catania John T.
Sweeney, Jr. William F.
Haas George E.
Lin Kuang Y.
RCA Corporation
Squire William
Tripoli Joseph S.
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