Metal fusion bonding – Process – Diffusion type
Patent
1976-07-16
1978-05-09
Smith, Al Lawrence
Metal fusion bonding
Process
Diffusion type
29420, 219243, 228 441R, 228243, 228263, 266250, B23K 1900
Patent
active
040882586
ABSTRACT:
Apparatus and method for joining, compacting and thermo-mechanically processing materials under controlled application of heat and evenly distributed mechanical pressure in a vacuum or inert gas environment, having particular usefulness in diffusion bonding, powder metallurgy, vacuum brazing and materials treatment. One or more workpieces or materials are pressed, joined, formed or treated by placing them in a reusable or permanent type, closable chamber having a movable wall portion, the same and/or other wall portions having a bellows construction. The chamber is evacuated and heated and the movable wall portion of the chamber evenly displaced towards an opposing portion of the chamber with concomitant bellows deformation of chamber wall portions operatively connected with the movable wall to provide for application of mechanical force to the materials in a substantially even distribution across the work by means of forcible inward movement of the movable chamber wall operatively pressing upon the materials to be joined or compacted.
REFERENCES:
patent: 3033973 (1962-05-01), Herbert
patent: 3093104 (1963-06-01), Bukata
patent: 3256598 (1966-06-01), Kramer et al.
patent: 3550254 (1970-12-01), Greenspan et al.
patent: 3670397 (1972-06-01), Lewis
General Dynamics Corporation
Ramsey K. J.
Schurman Charles E.
Smith Al Lawrence
LandOfFree
Apparatus and method for vacuum hot press joining, compacting an does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for vacuum hot press joining, compacting an, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for vacuum hot press joining, compacting an will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2353320