Apparatus and method for use in testing a semiconductor wafer

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07053646

ABSTRACT:
The present disclosure relates to an apparatus for use with a probe station in the testing of semiconductor wafers. In one embodiment, an apparatus for testing semiconductor devices includes a first plate and a second plate. The first plate is configured to be mounted to and completely removable from the head stage of a probe station. The second plate is configured to be removably coupled to the first plate and has a major aperture for receiving a probe-card assembly. Docking equipment desirably is mounted to a major surface of the second plate to facilitate docking of a tester to the probe station.

REFERENCES:
patent: 5068601 (1991-11-01), Parmenter
patent: 5220279 (1993-06-01), Nagasawa
patent: 5264787 (1993-11-01), Woith et al.
patent: 5355079 (1994-10-01), Evans et al.
patent: 5410259 (1995-04-01), Fujihara et al.
patent: 5489853 (1996-02-01), Nakajima
patent: 5528158 (1996-06-01), Sinsheimer et al.
patent: 5575073 (1996-11-01), von Wedemayer
patent: 5642056 (1997-06-01), Nakajima et al.
patent: 5644246 (1997-07-01), Lee et al.
patent: 5647178 (1997-07-01), Cline
patent: 5656942 (1997-08-01), Watts et al.
patent: 5778485 (1998-07-01), Sano et al.
patent: 5804983 (1998-09-01), Nakajima et al.
patent: 5814158 (1998-09-01), Holländer et al.
patent: 5828225 (1998-10-01), Obikane et al.
patent: 5861759 (1999-01-01), Bialobrodski et al.
patent: 5913555 (1999-06-01), Richter et al.
patent: 5923180 (1999-07-01), Botka et al.
patent: 5949244 (1999-09-01), Miley
patent: 5961728 (1999-10-01), Kiser et al.
patent: 5968282 (1999-10-01), Yamasaka
patent: 5974662 (1999-11-01), Eldridge et al.
patent: 6056627 (2000-05-01), Mizuta
patent: 6060892 (2000-05-01), Yamagata
patent: 6078186 (2000-06-01), Hembree et al.
patent: 6114869 (2000-09-01), Williams et al.
patent: 6118290 (2000-09-01), Sugiyama et al.
patent: 6121058 (2000-09-01), Shell et al.
patent: 6166553 (2000-12-01), Sinsheimer
patent: 6271658 (2001-08-01), Vallinan et al.
patent: 6304092 (2001-10-01), Jordan
patent: 6306187 (2001-10-01), Maeda et al.
patent: 6408500 (2002-06-01), Orsillo
patent: 6424141 (2002-07-01), Hollman et al.
patent: 6433562 (2002-08-01), McAllister et al.
patent: 6476626 (2002-11-01), Aldaz et al.
patent: 6483798 (2002-11-01), Wu
patent: 6741072 (2004-05-01), Orsillo
patent: 6813817 (2004-11-01), Orsillo
patent: 6839948 (2005-01-01), Orsillo
patent: 6853205 (2005-02-01), Cheng et al.
patent: 0699 913 (1996-03-01), None
patent: 05144892 (1993-06-01), None
patent: WO 96/30772 (1996-10-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and method for use in testing a semiconductor wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for use in testing a semiconductor wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for use in testing a semiconductor wafer will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3647592

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.