Apparatus and method for uniformly polishing a wafer

Details Apparatus and method for uniformly polishing a wafer Apparatus and method for uniformly polishing a wafer

1996-07-10

1997-04-29

Smith, James G.

Abrading

Abrading process

Utilizing fluent abradant

451 54, 451 63, 451285, B24B 100, B24B 716

Patent

active

056243006

ABSTRACT:
For providing a method for polishing in which it is possible to polish a substance uniformly over a whole surface of a wafer without observing the polished surface of the wafer halfway through polishing, a wafer with current detective patterns formed of conductors directly contacted with a semiconductor substrate, and an insulating film covering the current detective patterns is held by a wafer holder with conductivity, and the insulating film is polished by a polisher in which a supporting plate with conductivity is exposed in openings through a polishing cloth while supplying a polishing slurry containing ions.

REFERENCES:
patent: 4211041 (1980-07-01), Sakullevich et al.
patent: 4270316 (1981-06-01), Kramer

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