Apparatus and method for uniformly polishing a wafer

Details Apparatus and method for uniformly polishing a wafer Apparatus and method for uniformly polishing a wafer

1993-10-08

1996-10-08

Lavinder, Jack W.

Abrading

Abrading process

Utilizing fluent abradant

451 41, 451 54, 451 63, 451 28, 451287, 451288, 451289, 451908, B24B 100, B24B 716

Patent

active

055625290

ABSTRACT:
An apparatus and method for polishing a semiconductor wafer. A polisher includes a supporting plate having a conductive film and a polishing cloth formed on the conductive film of the supporting plate. The polishing cloth has a plurality of openings to expose the conductive film. A wafer holder has a conductive wafer holding surface to hold a semiconductor wafer having current detective patterns and an insulating film covering the current detective patterns. A polishing slurry supply device supplies a polishing slurry including ions to either the polishing cloth or the semiconductor wafer. A current detecting device, connected to the supporting plate and the wafer holder, detects a magnitude of a current flowing across the supporting plate and the wafer holder through the conductive wafer holding surface, the semiconductor wafer held by the wafer holder, the current detective patterns of the semiconductor wafer, the polishing slurry filled in the openings of the polishing cloth, and the conductive film.

REFERENCES:
patent: 4211041 (1980-07-01), Sakulevich
patent: 4270316 (1981-06-01), Kramer
F. B. Kaufman, et al., J. Electrochem. Soc., vol. 138, No. 11, Nov. 1991, pp. 3460-3464.

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