Apparatus and method for thermally coupling a heat sink to a lea

Details Apparatus and method for thermally coupling a heat sink to a lea Apparatus and method for thermally coupling a heat sink to a lea

1993-07-23

1995-02-07

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437214, 437217, 437219, 437220, H01L 2160

Patent

active

053875540

ABSTRACT:
A molded plastic package for an integrated-circuit die includes a lead frame having a central die-attach paddle. One side of the die-attach paddle has an integrated-circuit die fixed thereto. A heat sink member is resiliently fixed to the other side of the die-attach paddle using a layer of viscous thermal grease between the heat sink member and the other side of the die-attach paddle. One or more holes are formed in the lead frame and are engaged by corresponding studs on the heat sink. The stud has a shoulder portion which engages the lead frame to prevent the stud from further passing through the hole in the lead frame.

REFERENCES:
patent: 3611046 (1971-10-01), Covert
patent: 3930114 (1975-12-01), Hodge
patent: 4092697 (1978-05-01), Spaight
patent: 5091341 (1992-02-01), Asada et al.
patent: 5162975 (1992-11-01), Matta et al.
patent: 5200809 (1993-04-01), Kwon
patent: 5218215 (1993-06-01), Liang et al.

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