Apparatus and method for thermal processing of substrate

Electric heating – Heating devices – Combined with container – enclosure – or support for material...

Reexamination Certificate

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C219S413000, C219S502000, C392S416000, C374S131000

Reexamination Certificate

active

07935913

ABSTRACT:
A thermal processing apparatus (1) comprises a chamber body (6), a holding part (7) for holding a substrate (9) inside the chamber body (6), a light emitting part (5) for heating the substrate (9) through light irradiation and a light measuring part (2) for measuring light energy. The light measuring part (2) comprises a calorimeter (24) disposed outside the chamber body (6), a light guide structure (20) for guiding the light inside the chamber body (6) to the calorimeter (24) and a calculation part (25) for performing computations on the basis of an output of the calorimeter (24). In the thermal processing apparatus (1), by measuring the light from the light emitting part (5) by the calorimeter (24), it is possible to measure the energy of light emitted from the light emitting part (5) during thermal processing inside chamber body (6) and obtain a surface temperature of the substrate (9) by the calculation part (25).

REFERENCES:
patent: 4571486 (1986-02-01), Arai et al.
patent: 4649261 (1987-03-01), Sheets
patent: 5001327 (1991-03-01), Hirasawa et al.
patent: 5705224 (1998-01-01), Murota et al.
patent: 5743643 (1998-04-01), Gronet et al.
patent: 6191397 (2001-02-01), Hayasaki et al.
patent: 6375348 (2002-04-01), Hebb et al.
patent: 6417515 (2002-07-01), Barrett et al.
patent: 6530687 (2003-03-01), Suzuki et al.
patent: 6603101 (2003-08-01), Hayasaki et al.
patent: 6726356 (2004-04-01), Tanaka et al.
patent: 6839507 (2005-01-01), Adams et al.
patent: 7041931 (2006-05-01), Jennings et al.
patent: 7041939 (2006-05-01), Hosokawa
patent: 2001/0006530 (2001-07-01), Adams et al.
patent: 2001/0010308 (2001-08-01), Hauf et al.
patent: 2002/0139790 (2002-10-01), Adams et al.
patent: 2002/0141477 (2002-10-01), Akahori et al.
patent: 2004/0013418 (2004-01-01), Kusuda et al.
patent: 2004/0149715 (2004-08-01), Timans et al.
patent: 2005/0236395 (2005-10-01), Timans et al.
patent: 57-162340 (1982-10-01), None
patent: 59-169125 (1984-09-01), None
patent: 60-258928 (1985-12-01), None
patent: 62-15817 (1987-01-01), None
patent: 62-105419 (1987-05-01), None
patent: 3-145123 (1991-06-01), None
patent: 3-197680 (1991-08-01), None
patent: 4-291916 (1992-10-01), None
patent: 5-025644 (1993-02-01), None
patent: 63-166219 (1998-07-01), None
patent: 10-233370 (1998-09-01), None
patent: 11-135449 (1999-05-01), None
patent: 2002-357660 (2002-12-01), None
Japanese Office Action issued Jan. 30, 2008.
Office Action issued Oct. 28, 2009 by Japanese Patent Office in connection with counterpart Japanese Patent Application No. 2003-325636 (JP62-105419 and JP3-197680 were previously submitted with an Information Disclosure Statement filed on Feb. 7, 2008 and are therefore not enclosed.).

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