Apparatus and method for the electrolytic plating of layers onto

Details Apparatus and method for the electrolytic plating of layers onto Apparatus and method for the electrolytic plating of layers onto

1988-01-12

1989-08-08

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204212, 204218, 204228, 204DIG7, 360135, C25D 700, C25D 1700

Patent

active

048550205

ABSTRACT:
An apparatus for the electrolytic plating of computer memory discs comprising a plating container for the receipt of a liquid plating bath, a spindle fitted to the plating container, a prime mover connected to the spindle for causing relative rotational movement, a fixed and non-translatable stationary anode attached to the plating container, an electrical transmission system connected to the spindle and to the anode, and suitable current distribution controllers positioned within the plating container. The spindle has a receiving area for fixing to the inner diameter of a computer memory disc. The stationary anode is positioned on opposite sides of the receiving area of the spindle. The electrical transmission system includes a contact surface for establishing electrical contact with the edge of a computer memory disc. The current distribution controllers are adjacent the contact surface of the electrical conductors.

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