Optical: systems and elements – Single channel simultaneously to or from plural channels – By partial reflection at beam splitting or combining surface
Patent
1996-07-02
1997-12-16
Nelms, David C.
Optical: systems and elements
Single channel simultaneously to or from plural channels
By partial reflection at beam splitting or combining surface
356399, 29833, G02B 2714, G01B 1100, H01R 4300
Patent
active
056991932
ABSTRACT:
For flip-chip mounting of a component with its contact surface on the contact surface of substrate, the component or the substrate is held at the free end of a lever arm which pivots around an axis, and the other part is held on a support. In a beam path between an optical device, especially a viewing device, and the contact surfaces of the two parts, a semireflecting mirror is provided to provide images of the two contact surfaces simultaneously in the optical viewing device. A first point on the one contact surface, a second point on the other contact surface, a third point on the mirror surface, and the pivot axis of the lever arm form the corners of a square. The beam path between the optical device and the semireflecting mirror is a beam path parallel to the optical axis of the optical device, the beam striking the mirror at an angle of approximately 45.degree.. Before the part is set down onto the other part, a first lens, which focuses the beam path onto this contact surface, is located between the mirror and the contact surface of this one part, while a second lens, which focuses the beam path onto the contact surface of the other part, is provided between the mirror and the contact surface of the other part. The two lenses and the mirror are attached in an aligned state to brackets, the lenses being moved out of the pivot range of the lever arm by means of a motion device before the parts are bonded to each other.
REFERENCES:
patent: 3684384 (1972-08-01), Hojo
patent: 3963353 (1976-06-01), Hemstreet
patent: 4742947 (1988-05-01), Coffman et al.
patent: 5212880 (1993-05-01), Nishiguchi et al.
patent: 5311288 (1994-05-01), Shahar
patent: 5311304 (1994-05-01), Monno
"Equipment for Flip Chip Bonding", VDI/VDE Technologie-Zentrum Informationstechnik GmbH (1992).
Biesenbach Jens
Monno Bernd
Treusch Georg
Finetech Gesellschaft Fur Electronik Technologie mbH
Mack Ricky
Nelms David C.
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