Apparatus and method for testing semiconductor devices formed on

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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324754, 324758, G01R 3126, G01R 3102

Patent

active

061247251

ABSTRACT:
The present specification and drawings disclose a testing apparatus designed for testing semiconductor elements formed on a semiconductor wafer. The testing apparatus comprises a main chuck having a surface on which a semiconductor wafer is placed, a contactor which is brought into contact with the semiconductor wafer, the contactor having probe terminals which are simultaneously brought into electric contact with a plurality of semiconductor elements formed on the semiconductor wafer, a reliability test mechanism for testing reliability of the semiconductor elements, an electric characteristic test mechanism for testing electric characteristics of the semiconductor element, and a switch mechanism for switching between the reliability test mechanism and the electric characteristic test mechanism such that the reliability test mechanism and the electric characteristic test mechanism are sequentially connected to the contactor when this contactor is in contact with the semiconductor wafer placed on the main chuck.

REFERENCES:
patent: 5049816 (1991-09-01), Moslehi
patent: 5517126 (1996-05-01), Yamaguchi
patent: 5570032 (1996-10-01), Atkins et al.
patent: 5912555 (1999-06-01), Akaike et al.
patent: 5945834 (1999-08-01), Nakata

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