Apparatus and method for testing power and ground pins on a...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S537000

Reexamination Certificate

active

11148465

ABSTRACT:
To achieve the foregoing, and in accordance with the purpose of the present invention, a method and apparatus for testing individual power and ground pins on a semiconductor integrated circuit are disclosed. The method and apparatus includes organizing the power pins of the die into a first group of power pins and a second group of power pins. Each of the first group of power pins are then connected through a first set of resistors to a first common node, and each of the second group of power pins through a second set of resistors to a second common node respectively. A voltage is next applied between the first and second nodes. The voltage at each of the first group of pins is compared with a first threshold voltage and the voltage at each of the second group of pins is compared with a second threshold voltage. Individual bad pins in the first and second groups are identified based on the comparison.

REFERENCES:
patent: 5696451 (1997-12-01), Keirn et al.
patent: 6545497 (2003-04-01), Hebert et al.
patent: 6937006 (2005-08-01), West
patent: 7053637 (2006-05-01), Whitten et al.

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