Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor
Reexamination Certificate
2000-09-13
2002-12-17
Sherry, Michael (Department: 2829)
Electricity: measuring and testing
Measuring, testing, or sensing electricity, per se
With rotor
C324S754090, C324S758010, C324S761010
Reexamination Certificate
active
06496000
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a technique of fabricating a module device in which various circuit devices are mounted on a print circuit board, and more particularly to a module device testing apparatus and method that is adaptive for testing a large number of module devices at the same time.
2. Description of the Related Art
Generally, a conventional module device is fabricated by carrying out a step of printing a wiring according to a circuit configuration on a print circuit board (PCB), a step of loading various circuit devices including a integrated circuit chip, such as a memory chip, on the PCB printed with the wiring, and a step of soldering various circuit devices loaded on the PCB in such a manner that the circuit devices are connected to the wiring. In the module devices fabricated in this manner, the circuit devices may not be loaded at a predetermined position and also a poor soldering may occur. For these reasons, the module device fabrication method requires a process of testing the module devices so as to judge whether or not any module devices are poor.
Referring to
FIG. 1
, the conventional module device testing apparatus includes a socket board
3
provided with a number of sockets
2
, a test unit
4
provided with a loading head
6
to mount and release the socket board
3
, and a test control box
5
mounted to and released from the test unit
4
. Module devices
1
are mounted to or released from the sockets
2
on the socket board
3
with the aid of the loading head
6
. If the module devices
1
are mounted to the sockets
2
, then they are electrically connected, via the socket board
3
, to a main board (not shown) within the test unit
4
. Circuit and software for testing the module devices
1
are contained in the test control box
5
. The test control box
5
is electrically connected, via a connector installed at the side surface of the test unit
4
, to the main board. If the test control box
5
is mounted to the test unit
4
and an electric power is applied to the test control box
5
, then a test is performed in accordance with various test parameters of the module device
1
. Also, the test is performed within a high temperature chamber or a low temperature chamber so as to be aware of temperature characteristics of the module devices
1
.
However, the conventional module device testing apparatus has a drawback in that it must use an expensive test control box
5
, and has a problem in that, since the test is carried out at a single layer, the number of module devices
1
capable of being simultaneously tested is limited. In other words, in order to test a large number of module devices
1
at the same time, it is necessary to install a number of testing apparatus on the same plane. Since an area provided with the testing apparatus has a limit, however, the number of module devices
1
to be tested is limited.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the present invention to provide an apparatus and method of testing module devices that is capable of simultaneously testing a large number of module devices.
In order to achieve these and other objects of the invention, a module device testing apparatus according to one aspect of the present invention includes a plurality of test units mounted with a plurality of module devices; a high-temperature tunnel with at least two layers; movement means, provided within the high-temperature tunnel, for moving the test units at the same layer and between layers within the high-temperature tunnel; and test means for testing a poor pattern and an electrical characteristic of the module devices progressing within the high-temperature tunnel.
A module device testing apparatus according to another aspect of the present invention includes a plurality of test units mounted with a plurality of module devices and provided with a tester for testing a poor pattern and an electrical characteristic of the module devices; a high-temperature tunnel with at least two layers; movement means, provided within the high-temperature tunnel, for moving the test units at the same layer and between layers within the high-temperature tunnel; module device loading means for locating the module devices at a loading position of the high-temperature tunnel; module device unloading means for deriving the module devices located at the loading position of the high-temperature tunnel; control means for controlling the movement means within the high-temperature tunnel, the module device loading means and the module device unloading means and for generating an identification information and a control signal of the test units; reading means for supplying the control means with a test result information from the test units; and recording means for recording a producer information of the module devices and the test result information to the module devices.
A module device testing method according to still another aspect of the present invention includes the steps of entering a plurality of module devices into a high-temperature tunnel with at least two layers; making a test of the module devices within the high-temperature tunnel; and deriving the module devices having completed the high temperature test from the high-temperature tunnel.
REFERENCES:
patent: 5093984 (1992-03-01), Lape
patent: 6218852 (2001-04-01), Smith
patent: 6226188 (2001-05-01), Warren
patent: 6329831 (2001-12-01), Bui
Nguyen Trung Q.
Sherry Michael
Yuil Semicon Co., Ltd.
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