Apparatus and method for testing electronic component

Details Apparatus and method for testing electronic component Apparatus and method for testing electronic component

2005-08-30

2005-08-30

Nguyen, Vinh P. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S765010

Reexamination Certificate

active

06937043

ABSTRACT:
An apparatus for testing an electronic component includes a substrate having a cavity on the upper surface for accommodating an electronic component. The electronic component is inserted into the cavity from a second electrode side. From under the cavity, a connecting conductor extends in a direction that is substantially perpendicular to the thickness direction of the substrate. The connecting conductor is electrically connected to a through-hole electrode. The upper end of the through-hole electrode is further connected to a terminal pad placed on the upper surface of the substrate. Characteristics of the electronic component are measured by attaching a first probe and a second probe to a first substrate of the electronic component and the terminal pad, respectively.

REFERENCES:
patent: 4281888 (1981-08-01), Seaman
patent: 5088190 (1992-02-01), Malhi et al.
patent: 5578796 (1996-11-01), Bhatt et al.
patent: 6181147 (2001-01-01), Itoh
patent: 2001-332460 (2001-11-01), None

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