Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
1998-04-13
2002-01-01
Metjahic, Safet (Department: 2858)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S531000, C324S500000
Reexamination Certificate
active
06335627
ABSTRACT:
BACKGROUND OF THE INVENTION
1). Field of the Invention
This invention relates to an apparatus and a method for testing an electrical connection between a electrical contacts on a first side of an electronics package substrate and electrical terminals on a second, opposing side of the substrate.
2). Discussion of Related Art
Integrated circuits are usually manufactured within semiconductor chips. These semiconductor chips are then located on substrates and electrical connection is made between the integrated circuit and the substrate by way of C4 (controlled collapse chip connect), TAB (type automated bonding) tape, wire bonding or other techniques which are known in the art.
These substrates usually have first and second opposed surfaces with electrical contacts on the first surface and electrical terminals on the second surface. Various electrical connections extend between the electrical contacts and the electrical terminals.
The semiconductor chips, the substrates and the structures interconnecting the substrates with the integrated circuit are usually tested before being sold. In certain instances it may be required to test and isolate the electrical connections within the substrate.
FIG. 1
is an example of a substrate
10
of the above kind. First and second electrical contacts,
12
A and
12
B respectively, are located on a first surface
14
of the substrate
10
. First, second and third electrical terminals
16
A,
16
B and
16
C are located on a second, opposing surface
18
of the substrate
10
. The first electrical contact
12
A is electrically connected to the first electrical terminal
16
A. The second electrical contact is electrically connected to the second electrical terminal
16
B and to the third electrical terminal
16
C. For purposes of discussion, an electrical disconnection exists between the second electrical contact
12
B and the second electrical terminal
16
B. The electrical disconnection may be required to be detected for further analysis.
One conventional method of testing for electrical disconnections is by applying an electrical current over the first and second electrical contacts
12
A and
12
B, and shorting off the electrical terminals
16
A,
16
B and
16
C by means of a piece of foil. Such a technique would still allow current from the first electrical contact
12
A to the first electrical terminal
16
A, through the foil from the first electrical terminal
16
A to the third electrical terminal
16
C, and from the third electrical terminal
16
C to the second electrical contact
12
B. The electrical disconnection would therefore not be detected. What is required therefore is an apparatus and a method wherein individual contact can be made to the electrical contacts
12
A and
12
B and the electrical terminals
16
A,
16
B and
16
C.
SUMMARY OF THE INVENTION
An apparatus for testing an electrical connection between a first electrical contact on a first side of an electronics package substrate and a first electrical terminal on a second, opposing side of the substrate. A holder is provided which is capable of releasably receiving and holding a substrate. At least a first electrical pin is located on the holder. The first electrical pin is positioned to contact the first electrical contact on the first side of the substrate. A support structure is mounted to the holder. An electrical probe is mounted to the support structure. The electrical probe is movable relatively to the support structure between a first position and a second position. In the first position the electrical probe is distant from the first electrical terminal on the second side of the substrate. In the second position the electrical probe is in contact with the first electrical terminal.
REFERENCES:
patent: 4056773 (1977-11-01), Sullivan
patent: 4686465 (1987-08-01), Kruger
patent: 4868493 (1989-09-01), Becker
patent: 4912403 (1990-03-01), Siefers
patent: 5166601 (1992-11-01), Van Klooser
patent: 5389885 (1995-02-01), Swart
patent: 5835997 (1998-11-01), Yassine
patent: 5955888 (1999-09-01), Frederickson et al.
Blakely , Sokoloff, Taylor & Zafman LLP
Hollington Jermele M.
Intel Corporation
Metjahic Safet
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