Apparatus and method for temperature control of integrated...

Details Apparatus and method for temperature control of integrated... Apparatus and method for temperature control of integrated...

2006-07-18

2006-07-18

Bui, Bryan (Department: 2863)

Data processing: measuring, calibrating, or testing

Testing system

Of circuit

C324S760020

Reexamination Certificate

active

07079972

ABSTRACT:
One embodiment disclosed relates to an apparatus for temperature control of an integrated circuit on a circuit board. The apparatus includes a first resistor on the circuit board, a second resistor on the circuit board, and a heat conductive material. The heat conductive material is attached to both the first and second resistors and to a surface of a package containing the integrated circuit. Another embodiment disclosed relates to an apparatus that provides both cooling and heating functionality in order to maintain the operational temperature of the IC within an acceptable range.

REFERENCES:
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patent: 5844208 (1998-12-01), Tustaniwskyj et al.
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patent: 6476508 (2002-11-01), Strnad
patent: 6510400 (2003-01-01), Moriyama
patent: 2005/0122689 (2005-06-01), Pozzuoli
patent: 2006/0007614 (2006-01-01), Pozzouli et al.
LM56 Dual Output Low Power Thermostat, pp. 1-12; 2001 National Semiconductor Corporation.

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