Apparatus and method for tape bonding and testing of integrated

Details Apparatus and method for tape bonding and testing of integrated Apparatus and method for tape bonding and testing of integrated

1981-05-14

1983-10-25

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29574, 156627, 156902, 174 685, 324158R, 357 69, 357 70, G01R 3102, G01R 3122

Patent

active

044117191

ABSTRACT:
A metallic lead frame strip, method of manufacturing same, a test tape, a method of testing together with the art work for same is disclosed. The method of manufacturing includes a method for producing art work that provides for accuracy in etching both sides of the lead frame strip simultaneously and permits a highly accurate positioning of the bonding bumps of at least one integral bonding bump for each lead and also discloses leads having a plurality of bonding bumps for connecting electrically common portions of a chip to be tested. Also, the use of registration aids are disclosed which allow lead bumps to be registered to chip pads even though the bumps cannot be seen in the alignment step. The testing of the chip also includes a method and double-layer test strip that may be used repeatedly for testing successively larger chips having an increasing number of individual leads.

REFERENCES:
patent: 3440027 (1969-04-01), Hughe
patent: 3678385 (1972-07-01), Bruner
patent: 3777365 (1973-12-01), Umbaugh
patent: 3781596 (1973-12-01), Galli et al.
patent: 4220917 (1980-09-01), McMahon

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