Electric heating – Metal heating – For bonding with pressure
Patent
1988-03-14
1989-02-14
Shaw, Clifford C.
Electric heating
Metal heating
For bonding with pressure
219 85F, 219 85M, 228179, B23K 112
Patent
active
048048100
ABSTRACT:
A bonding apparatus for eutectically bonding tape leads to semiconductors and other substrates includes four separate bonding rails for applying heat. The bonding rails have a preselected distribution of mass along their length in order to compensate for uneven heating characteristics which are normally observed in linear heating elements. Usually, four such heat elements are orthogonally arranged at the bottom ends of four electric power buses. By attaching the heating elements to adjacent power buses, and coupling diagonally opposed pairs of the power buses to the positive and negative polarity of a current source, substantially uniform heating of all four elements may be achieved. The ability to provide uniform heating is critical for properly forming eutectic bonds.
REFERENCES:
patent: 4543462 (1985-09-01), Rossell
Clark James W.
Drummond Fred
Colwell Robert C.
Fairchild Semiconductor Corporation
Heslin James M.
Patch Lee
Shaw Clifford C.
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