Apparatus and method for surface treatment, and apparatus and me

Details Apparatus and method for surface treatment, and apparatus and me Apparatus and method for surface treatment, and apparatus and me

1996-07-09

1998-10-20

Ryan, Patrick

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 51, 42218605, 156345P, B23K 3700, B01J 1908, C23F 107

Patent

active

058234160

ABSTRACT:
There are disclosed a surface treatment device and a wire bonding device which are compact in size, have a high processing ability, are simple in construction, and achieve a low cost. The surface treatment device includes a base having a transfer path for transferring an object, a lid provided above the base for movement into and out of contact with an upper surface of the base, the lid contacting the base to form a sealed space on the upper surface of the base, an engagement and disengagement mechanism for moving the lid into and out of contact with the base, a transfer mechanism for feeding the object, disposed on the transfer path, into and out of a position beneath the lid when the lid is out of contact with the base, and a treatment portion for surface treating electrodes of the object disposed in the sealed space. A wire bonding mechanism is provided at a downstream portion of the transfer path.

REFERENCES:
patent: 4840702 (1989-06-01), Schumacher, III
patent: 4861563 (1989-08-01), Shekerjian et al.
patent: 4908095 (1990-03-01), Kagatsume et al.
patent: 5433371 (1995-07-01), Morisako
"Surface Treatment for Tungsten to Facilitate Wire Bonding," IBM Tech. Discl. Bull., vol. 33, No. 2, Jul. 1990, p. 89.

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