Apparatus and method for subsurface application

Planting – Liquid or gas soil treatment – Drilling machines

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

111150, 111152, 172724, A01C 2300

Patent

active

059965142

ABSTRACT:
The invention comprises an apparatus for the subsurface application of chemicals such as metham sodium in soil. A frame is shown, capable of being pulled across a field, the frame having a plurality of shanks with a plate and a rearwardly discharging wide angle flat spray nozzle mounted at the end of each shank. The plates all lie in a single plane, substantially horizontal to the soil's surface. Structure is provided for delivering the chemical from a reservoir to the nozzles. The chemical is thereby applied in a single pass at a depth of up to 12 inches, and allowed to migrate upward in the soil, thereby achieving application of the chemical in a discrete layer of the soil, without unduly disturbing the soil's surface.

REFERENCES:
patent: 1564083 (1925-12-01), Lyons
patent: 2285932 (1942-06-01), Leavitt
patent: 2357141 (1944-08-01), Singleton
patent: 2646012 (1953-07-01), Ingalls
patent: 2722902 (1955-11-01), Hyatt
patent: 2802435 (1957-08-01), Maxwell
patent: 2849970 (1958-09-01), Coberly et al.
patent: 2881848 (1959-04-01), Liston
patent: 3185117 (1965-05-01), Frantzen
patent: 3188989 (1965-06-01), Johnston
patent: 3608645 (1971-09-01), Meiners
patent: 3863842 (1975-02-01), McFarland et al.
patent: 3874593 (1975-04-01), Wilt
patent: 4079680 (1978-03-01), Davis
patent: 4116139 (1978-09-01), Sauer
patent: 4129082 (1978-12-01), Betulius
patent: 4211175 (1980-07-01), Van der Lely
patent: 4373455 (1983-02-01), Friggstad
patent: 4565141 (1986-01-01), Kopecky
patent: 4638748 (1987-01-01), Kopecky
patent: 4683826 (1987-08-01), Solie et al.
patent: 4773340 (1988-09-01), Williams et al.
patent: 5033398 (1991-07-01), Froc
patent: 5136954 (1992-08-01), Fetaz et al.
"TeeJet.RTM. Agricultural Spray Products Catalog #43," Spraying Systems Co., pp. 22-23.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and method for subsurface application does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for subsurface application, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for subsurface application will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-812430

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.