Planting – Liquid or gas soil treatment – Drilling machines
Patent
1996-10-03
2000-02-29
Batson, Victor
Planting
Liquid or gas soil treatment
Drilling machines
111118, A01C 2300
Patent
active
060295902
ABSTRACT:
The invention comprises an apparatus and method for the subsurface application of chemicals such as fertilizer, pesticides and fumigants in soil. A frame is shown, capable of being pulled across a field, the frame having a plurality of shanks with a shovel and an downward facing nozzle mounted at the end of each shank. The shovels all lie in a single plane, substantially horizontal to the soil's surface. Means are provided for delivering the chemical from a reservoir of such to the nozzles. The chemical is thereby applied in a single pass at a depth of up to 12 inches, and allowed to migrate upward in the soil, thereby achieving application of the chemical in a discreet layer of the soil, without unduly disturbing the soil's surface.
REFERENCES:
patent: 242862 (1881-06-01), Bartholomew et al.
patent: 1564083 (1925-12-01), Lyons
patent: 2285932 (1942-06-01), Leavitt
patent: 2646012 (1953-07-01), Ingalls
patent: 2684617 (1954-07-01), Johnston
patent: 2781733 (1957-02-01), Graham
patent: 2849970 (1958-09-01), Coberly et al.
patent: 3188989 (1965-06-01), Johnston
patent: 3335681 (1967-08-01), Main et al.
patent: 3605657 (1971-09-01), Brannan
patent: 3811387 (1974-05-01), Meiners
patent: 4048929 (1977-09-01), Zumbahlen
patent: 4079680 (1978-03-01), Davis
patent: 4116138 (1978-09-01), McFarland et al.
patent: 4116139 (1978-09-01), Sauer
patent: 4129082 (1978-12-01), Betulius
patent: 4373455 (1983-02-01), Friggstad
patent: 5033397 (1991-07-01), Colburn, Jr.
patent: 5452673 (1995-09-01), Bruce
Arriola D. Martin
Arriola James M.
LandOfFree
Apparatus and method for subsurface application does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for subsurface application, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for subsurface application will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-673142