Apparatus and method for substrate processing

Details Apparatus and method for substrate processing Apparatus and method for substrate processing

2004-05-11

2008-12-23

Stinson, Frankie L. (Department: 1792)

Cleaning and liquid contact with solids

Apparatus

With means for collecting escaping material

C118S052000, C134S025400, C134S033000, C134S148000, C134S183000, C134S902000

Reexamination Certificate

active

07467635

ABSTRACT:
A substrate processing apparatus10includes a holding table20for rotatably holding a wafer W, a nozzle40for supplying chemical solutions L1and L2to the wafer W, at least one light irradiation units G1and G2, and a pot30placed in the outer radius of the holding table20for collecting the processing solutions L1and L2that are scattered from the wafer W. The pot30also includes a cover70that can be moved in the direction of the axis of the holding table20so that a plurality of chemical solution collecting chambers M1and M2are formed in the pot by changing the position of the cover70.

REFERENCES:
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patent: 6596082 (2003-07-01), Chuang et al.
patent: 2001/0041229 (2001-11-01), Sakamoto et al.
patent: 2004/0050491 (2004-03-01), Miya et al.
patent: 1083589 (2001-03-01), None
patent: 5-283395 (1993-10-01), None

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