Package making – Methods – Plural covers
Reexamination Certificate
2006-08-29
2006-08-29
Huynh, Louis (Department: 3721)
Package making
Methods
Plural covers
C053S408000
Reexamination Certificate
active
07096648
ABSTRACT:
A method for packaging electronic components wherein each of the electronic components having a first surface and an opposite second surface is placed in each of a plurality of pockets of a first film, bottom of each of the pocket has a protrusion that contacts the second surface of the electronic component, the pockets of the first film with the electronic components therein is covered with a second film, a pressure difference between the pockets as covered with the second film and an exterior of the pockets is created so that part of the second film is stuck to the first surface of each electronic component by the pressure difference to secure the electronic components within the pockets.
REFERENCES:
patent: 4662514 (1987-05-01), Berbeco
patent: 5025923 (1991-06-01), Okui
patent: 5136827 (1992-08-01), Sawaya
patent: 5203143 (1993-04-01), Gutentag
patent: 5747139 (1998-05-01), Schenz
patent: 5757199 (1998-05-01), Maruyama
patent: 5828224 (1998-10-01), Maruyama
patent: 5986459 (1999-11-01), Fukaya et al.
patent: 6216419 (2001-04-01), Sakurai
patent: 6340088 (2002-01-01), Mouri et al.
Huynh Louis
Oki Electric Industry Co. Ltd.
VolentineFrancos&Whitt PLLC
LandOfFree
Apparatus and method for storing an electronic component,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for storing an electronic component,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for storing an electronic component,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3654159