Apparatus and method for storing an electronic component,...

Package making – Methods – Plural covers

Reexamination Certificate

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C053S408000

Reexamination Certificate

active

07096648

ABSTRACT:
A method for packaging electronic components wherein each of the electronic components having a first surface and an opposite second surface is placed in each of a plurality of pockets of a first film, bottom of each of the pocket has a protrusion that contacts the second surface of the electronic component, the pockets of the first film with the electronic components therein is covered with a second film, a pressure difference between the pockets as covered with the second film and an exterior of the pockets is created so that part of the second film is stuck to the first surface of each electronic component by the pressure difference to secure the electronic components within the pockets.

REFERENCES:
patent: 4662514 (1987-05-01), Berbeco
patent: 5025923 (1991-06-01), Okui
patent: 5136827 (1992-08-01), Sawaya
patent: 5203143 (1993-04-01), Gutentag
patent: 5747139 (1998-05-01), Schenz
patent: 5757199 (1998-05-01), Maruyama
patent: 5828224 (1998-10-01), Maruyama
patent: 5986459 (1999-11-01), Fukaya et al.
patent: 6216419 (2001-04-01), Sakurai
patent: 6340088 (2002-01-01), Mouri et al.

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