Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1996-12-20
1999-10-26
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257676, 257672, 257686, 257722, H01L 2302, H01L 2328
Patent
active
059733934
ABSTRACT:
An apparatus and method for packaging an integrated circuit having a semiconductor die with electronic circuitry disposed thereon includes lead frames for mounting thereon solder balls of a ball grid array packaging structure. In one embodiment, the semiconductor die is coupled to conductors of the lead frame via gold wires attached to both the semiconductor die and the lead frame. The lead frame is encapsulated in plastic with apertures disposed therein for exposing upper and lower portions of conductors of the lead frame. The apertures are filled with solder balls to contact both the upper and lower portions of the lead frame conductors. Solder balls on the top of one integrated circuit package may be connected to mating solder balls on the bottom of another integrated circuit package, and so on, thereby achieving multiple stacking of integrated circuit packages.
REFERENCES:
patent: 5197183 (1993-03-01), Chia et al.
patent: 5435482 (1995-07-01), Variot et al.
patent: 5461197 (1995-10-01), Hiruta et al.
Chia Chok J.
Lim Seng-Sooi
Low Qwai H.
Arroyo Teresa M.
Duong Hung Van
LSI Logic Corporation
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