Apparatus and method for spray-cooling an electronic module

Details Apparatus and method for spray-cooling an electronic module Apparatus and method for spray-cooling an electronic module

1996-04-10

1997-11-18

Doerrler, William

Refrigeration

Processes

Treating an article

622592, 62376, 361699, 361689, F25D 1702, F25D 2312, H05K 720

Patent

active

056875770

ABSTRACT:
The apparatus includes a plate (10) having a first layer (12) and a second layer (14) opposed to the first layer (12). The second layer (14) includes a first substrate. A fluid distributing manifold (28) is disposed proximate the first layer (12). A nozzle housing (30) having an aperture (36) is disposed in the first fluid distributing manifold (28).

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