Apparatus and method for splitting substrates

Details Apparatus and method for splitting substrates Apparatus and method for splitting substrates

2006-03-28

2006-03-28

Rose, Robert A. (Department: 3723)

Stone working

Splitting, shearing, and punching

C125S040000

Reexamination Certificate

active

07017570

ABSTRACT:
The invention provides an apparatus for splitting a substrate apart, the substrate comprising two adjoining wafers defining between them a cleavage plane, the apparatus being characterized in that it comprises:means for feeding splitter means with a plurality of substrates disposed in a substrate-storage direction;splitter means for splitting apart wafers of the substrates, the splitter means comprising moving jaws; andmeans for performing controlled displacement of certain substrate wafers after they have been split apart in a direction that is substantially parallel to the substrate-storage direction, whereby the apparatus is suitable for splitting apart the plurality of substrates. The invention also provides an associated splitting method.

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