Apparatus and method for soldering

Details Apparatus and method for soldering Apparatus and method for soldering

1999-11-15

2000-09-26

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228 561, 228219, 219233, B23K 3102, B23K 306, B23K 3514, B23K 3538, H05B 100

Patent

active

061232513

ABSTRACT:
A solder head is adapted to direct the flow of solder from a solder fountain. The solder head includes a wall forming a passage through which solder can flow upwardly and having an edge portion over which solder can flow from the passage. The solder head also includes a shield connected to the wall. The shield and the wall at least partially define an overflow passage through which solder can flow downwardly. The shield is configured to prevent contact between solder and an electronic component adjacent the solder head. Corresponding soldering systems and soldering methods are also provided.

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