Apparatus and method for solder reflow bottom cooling

Details Apparatus and method for solder reflow bottom cooling Apparatus and method for solder reflow bottom cooling

1996-02-01

1998-07-28

Heinrich, Samuel M.

Metal fusion bonding

With means to cool work or product

219288, 432152, H05K 334

Patent

active

057852332

ABSTRACT:
An apparatus and method for cooling one side of a double sided product as the product is being reflow soldered is presented. A cooling assembly directs cold gas to a first side of the product which has previously had the first side reflow soldered, while at approximately the same time, a heating assembly directs hot gas to a second side of the product. The second side of the product is reflow soldered while the first side of the product is maintained at a temperature below the melting point of the solder.

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