Apparatus and method for slicing an ingot

Details Apparatus and method for slicing an ingot Apparatus and method for slicing an ingot

2007-04-12

2008-10-07

Morgan, Eileen P. (Department: 3723)

Stone working

Sawing

Reciprocating

C125S021000, C451S037000, C451S304000, C083S651100

Reexamination Certificate

active

07431028

ABSTRACT:
A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly slices one side of the ingot. A second wire secondly slices the remaining portion of the ingot to form a second slicing portion continued from the first slicing portion, wherein the first wire has a smaller diameter than that of the second wire.

REFERENCES:
patent: 5715806 (1998-02-01), Tonegawa et al.
patent: 5937844 (1999-08-01), Kiuchi et al.
patent: 5947798 (1999-09-01), Toyama
patent: 6062209 (2000-05-01), Oishi
patent: 6352071 (2002-03-01), Kononchuk et al.
patent: 6802928 (2004-10-01), Nakashima
patent: 7025665 (2006-04-01), Bender
patent: 2004/0084042 (2004-05-01), McAulay et al.
patent: 2006/0249135 (2006-11-01), Matsumoto
patent: 9-262827 (1997-10-01), None
Patent Abstracts of Japan, Publication No. 09-262827; Date of Publication: 10-07-1997; in the name of Nakazato Yasuaki et al.

Affiliated with

Also associated with

Rating

Apparatus and method for slicing an ingot does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for slicing an ingot, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for slicing an ingot will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3992735