Stone working – Sawing – Reciprocating
Patent
1997-07-07
1999-03-09
Morgan, Eileen P.
Stone working
Sawing
Reciprocating
125 21, B28D 102
Patent
active
058787372
ABSTRACT:
An apparatus and method for slicing a workpiece, in particular, a polysilicon or single crystal silicon ingot, utilizing a diamond impregnated wire in which the workpiece (or ingot) is rotated about its longitudinal axis as the diamond wire is driven orthogonally to it and advanced from a position adjoining the outer diameter ("OD") of the ingot towards its inner diameter ("ID"). In this manner, the diamond wire cuts through the workpiece at a substantially tangential point to the circumference of the cut instead of through up to the entire diameter of the piece and single crystal silicon ingots of 300 mm to 400 mm or more may be sliced into wafers relatively quickly, with minimal `kerf" loss and less extensive follow-on lapping operations.
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Laser Technology West Limited Brochure,"Diamond Wire Selection".
Laser Technology West Limited Brochure, "Solid State Controller/Capstan/Accessories".
Laser Technology West Limited Brochure, "Cutting with diamond Wire".
Laser Technology West Limited Brochure, "Model 203000/Vertical Wire Saw".
Laser Technology West Limited Brochure, "Model 214000/Crystal Wire Saw".
Laser Technology West Limited Brochure, "Model 206000/Laboratory Wire Saw".
Laser Technology West Limited Brochure, "Model 208000/Guillotine Series Saws".
Laser Technology West Limited Brochure, "Automatic Guillotine Series Saws".
Laser Technology West Limited Brochure, "Model 228120/Profile Wire Saw".
Kubida William J.
Laser Technology West Limited
Morgan Eileen P.
Wahl John R.
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