Apparatus and method for slicing a wafer

Details Apparatus and method for slicing a wafer Apparatus and method for slicing a wafer

1989-04-28

1990-01-23

Schmidt, Frederick R.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51323, B24B 700

Patent

active

048949566

ABSTRACT:
In an apparatus and a method for slicing a cylindrical semiconductor ingot into thin wafer pieces using an inner peripheral sliding blade, a grind stone shaft with a grind stone mounted to the tip end thereof is located movably axially within a rotor provided with the inner perpheral sliding blade so that the grind stone shaft and rotor can be rotated integrally but axially movable relative to each other. the grind stone and slicing blade are arranged effieciently so that, after the semiconductor ingot is sliced with the slicing blade, the grind stone approaches the end face of the ingot to grind it. This can save a lapping step, thereby improving working efficiency.

REFERENCES:
patent: 3828758 (1974-08-01), Cary
patent: 4084354 (1978-04-01), Grandia et al.
patent: 4756796 (1988-07-01), Saitou

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