Etching a substrate: processes – Mechanically shaping – deforming – or abrading of substrate
Patent
1996-04-26
1998-11-24
Powell, William
Etching a substrate: processes
Mechanically shaping, deforming, or abrading of substrate
216 84, 216 88, 156345, 438691, H01L 2100
Patent
active
058402020
ABSTRACT:
Apparatus for shaping a polishing pad includes a pad shaping tool and a fixture for holding the pad shaping tool free of fixed connection to the fixture. The pad shaping tool has a pad shaping surface which engages a polishing surface of the polishing pad to shape that surface. The pad shaping surface is sized for engaging the polishing surface across it entire width. The fixture constrains the tool from movement about the center of rotation of the polishing pad and constrains the center of the tool from substantial radial movement with respect to the pad. A method for shaping the polishing pad is also disclosed.
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Written description of an "abrading member" disclosed in application of Harold J. Hileman et al., Ser. No. 08/242,560, allowed Jan. 22, 1996.
MEMC Electronic Materials , Inc.
Powell William
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