Printing – Stenciling – Stencil and work support
Patent
1995-04-14
1997-04-29
Funk, Stephen R.
Printing
Stenciling
Stencil and work support
101129, B41F 1518
Patent
active
056238720
ABSTRACT:
A screen printing apparatus and method suitable for applying solder paste on a printed circuit board, wherein a printed circuit board is brought just under a mask plate with patterned holes. The patterned holes are filled with solder paste. The printed circuit board is separated from the mask plate using intermittent movements that lower the adhesivity of the solder paste located nearest to the walls of the patterned holes so that the solder paste is easily separated from the patterned holes and the solder paste, which remains on the printed circuit board, is not deformed.
REFERENCES:
patent: 4902371 (1990-02-01), Andris et al.
patent: 5174201 (1992-12-01), Andris et al.
Funk Stephen R.
Matsushita Electric - Industrial Co., Ltd.
LandOfFree
Apparatus and method for separating a mask plate and printed cir does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for separating a mask plate and printed cir, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for separating a mask plate and printed cir will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-699306