Apparatus and method for selective area deposition of thin films

Coating apparatus – Gas or vapor deposition – With treating means

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118723CB, 20429805, 20429806, C23C 1604, C23C 1404

Patent

active

059102209

ABSTRACT:
An ion beam deposition process for selective area deposition on a polarized substrate uses a potential applied to the substrate which allows the ionized particles to reach into selected areas for film deposition. Areas of the substrate to be left uncoated are held at a potential that repells the ionized particles.

REFERENCES:
patent: 5254417 (1993-10-01), Wada

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and method for selective area deposition of thin films does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for selective area deposition of thin films, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for selective area deposition of thin films will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1681642

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.