Apparatus and method for selective area deposition of thin films

Details Apparatus and method for selective area deposition of thin films Apparatus and method for selective area deposition of thin films

1992-11-09

1994-10-11

Padgett, Marianne

Coating processes

Direct application of electrical, magnetic, wave, or...

Ion plating or implantation

427527, 427528, 427570, B05D 306

Patent

active

053545834

ABSTRACT:
An ion beam deposition process for selective area deposition on a polarized substrate uses a potential applied to the substrate which allows the ionized particles to reach into selected areas for film deposition. Areas of the substrate to be left uncoated are held at a potential that repells the ionized particles.

REFERENCES:
patent: 4155735 (1979-05-01), Ernsberger
patent: 4480010 (1984-10-01), Sasanuma et al.
patent: 4944961 (1990-07-01), Lu et al.
patent: 4976818 (1990-12-01), Hashimoto et al.
patent: 5128173 (1992-07-01), Kugan
patent: 5206060 (1993-04-01), Balian et al.
Yamada et al., Film Deposition and Buried Layer Formation by Mass-Analyzed Ion Beams, Nuclear Instruments & Methods in Physics, 1985, pp. 439-446, no month.

Affiliated with

Also associated with

Rating

Apparatus and method for selective area deposition of thin films does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for selective area deposition of thin films, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for selective area deposition of thin films will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1657256