Package making – With cover-adjunct application or formation – Adjunct comprising provision to secure cover
Patent
1988-01-15
1990-05-08
Culver, Horace M.
Package making
With cover-adjunct application or formation
Adjunct comprising provision to secure cover
53329, 53900, B65B 5102, B65B 5120
Patent
active
049226827
ABSTRACT:
A capsule sealing and banding machine (10) and method in which capsules (C) are supplied from a supply hopper (23) to a rotating capsule transfer plate (12) for banding and sealing of the capsules as they pass over sets of sealing and banding wheels (63) at angularly-spaced-apart sealing and banding stations (13 and 15, respectively). The machine has an improved capsule feed means (30) for feeding the capsules from the hooper to the transfer plate, including a resilient gate (46) at the discharge end of the feed means, and a pivoted gate (43) at the discharge end of the hopper. In addition, independent variable speed drive means (M,62) is connected with the sealing and banding wheels, and the reservoirs (65 and 66) for the sealing and banding fluids are mounted on slides (67) for easy removal. Improved capsule transport trays (17) have hemispherical recesses (56) therein for supporting the capsules at their ends.
REFERENCES:
patent: 3200556 (1965-08-01), Ackley
patent: 4584817 (1986-04-01), Yamamoto et al.
patent: 4756902 (1988-07-01), Harvey et al.
patent: 4761932 (1988-08-01), Harvey et al.
patent: 4793119 (1988-12-01), Maso
patent: 4802323 (1989-02-01), Garris et al.
Tait Charles N.
Volpe Ralph A.
Bell Craig M.
Culver Horace M.
Scola, Jr. Daniel A.
Warner-Lambert & Company
LandOfFree
Apparatus and method for sealing and banding capsules does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for sealing and banding capsules, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for sealing and banding capsules will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2341182