Apparatus and method for rework dressing of a chip site

Details Apparatus and method for rework dressing of a chip site Apparatus and method for rework dressing of a chip site

1979-05-07

1982-03-30

Crane, Daniel C.

Metal working

Filing

29 81H, 29557, 51310, 228162, 228 19, B23D 7902

Patent

active

043217389

ABSTRACT:
Apparatus and method for rework dressing a chip site on a substrate prior to rejoining a chip by solder reflow. A compliant mask is aligned and placed on the substrate so that remnant solder columns on chip site pads protrude through holes in the mask. A brush mechanically removes excess solder and dresses any remaining solder columns to uniform shapes and volumes.

REFERENCES:
patent: 1145654 (1915-07-01), Anderson
patent: 1431917 (1922-10-01), Antaramian
patent: 2483424 (1949-10-01), Martines
patent: 3211354 (1965-10-01), Dugard et al.
patent: 3584362 (1971-06-01), Hazel et al.
patent: 3646648 (1972-03-01), Kappelman et al.
patent: 3746239 (1973-07-01), Auray
patent: 3751799 (1973-08-01), Reynolds
Schink, K. et al., "Cleaning of Solder Pads Prior to a Rework Operation", from IBM Technical Disclosure Bulletin, vol. 18, No. 5, Oct. 1975, pp. 1384, 1385.
Puttlitz, K. J. et al., "Cleaning of Solder Pads Prior to a Rework Operation", from IBM Technical Disclosure Bulletin, vol. 19, No. 3, Aug. 1976, pp. 939, 940.

Affiliated with

Also associated with

Rating

Apparatus and method for rework dressing of a chip site does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for rework dressing of a chip site, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for rework dressing of a chip site will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-376889