Apparatus and method for removing meltable material from a subst

Details Apparatus and method for removing meltable material from a subst Apparatus and method for removing meltable material from a subst

1995-06-05

1997-04-15

Ramsey, Kenneth J.

Metal fusion bonding

Process of disassembling bonded surfaces, per se

228 19, H01L 2144

Patent

active

056201320

ABSTRACT:
The present invention relates generally to a new apparatus and method for removing solid material and liquid material that may contain solid material from a substrate. More particularly, the invention encompasses an apparatus and method for removing molten solder which may contain solid particles and solder balls or columns from a substrate using a unique squeegee. Also, disclosed is a method for removing solder balls or columns from a substrate using a backer having an adhesive thereon.

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