Apparatus and method for removing known good die using hot shear

Details Apparatus and method for removing known good die using hot shear Apparatus and method for removing known good die using hot shear

1995-06-05

1997-06-10

Heinrich, Samuel M.

Metal fusion bonding

With means to remove, compact, or shape applied flux or filler

156584, H05K 330, B23K 300

Patent

active

056367813

ABSTRACT:
Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.

REFERENCES:
patent: 3834605 (1974-09-01), Coffin
patent: 4360142 (1982-11-01), Carpenter et al.
patent: 4360960 (1982-11-01), Patel
patent: 4526859 (1985-07-01), Christensen et al.
patent: 4561584 (1985-12-01), Hog
patent: 4740099 (1988-04-01), Philipoussi
patent: 4767047 (1988-08-01), Todd et al.
patent: 4894910 (1990-01-01), Reimer et al.
patent: 4962878 (1990-10-01), Kent
patent: 5007163 (1991-04-01), Pope et al.
patent: 5054681 (1991-10-01), Kim
patent: 5148968 (1992-09-01), Schmidt et al.
patent: 5170930 (1992-12-01), Dolbear et al.
patent: 5173451 (1992-12-01), Kinsman et al.
patent: 5219520 (1993-06-01), Borfman et al.
patent: 5237269 (1993-08-01), Aimi et al.
patent: 5284286 (1994-02-01), Brofman et al.
IBM Technical Disclosure Bulletin "Chip with Lengthened Solder Joints Using Shape Memory Alloy", vol. 29, No. 12, pp. 5213, 5214, May 1987.
IBM Technical Disclosure Bulletin "Bimetal Component Removal", vol. 33, No. 10A, pp. 43,44, Mar. 1991.
Research Disclosure "Individual Chip Separation Device", Kenneth Mason Publications, No. 329 (32921), Sep. 1991.
Research Disclosure, "Novel Solder Array Module Rework/Tool", Kenneth Mason Publications, No. 330 (330110), Oct. 1991.
IBM Technical Disclosure Bulletin, vol. 35, No. 4A, pp. 25-27 (Sep. 1992).
IBM Technical Disclosure Bulletin, vol. 29, No. 6, pp. 2784-2785 (Nov. 1986).
IBM Technical Disclosure Bulletin, vol. 32, No. 10A, p. 195 (Mar. 1990).
IBM Technical Disclosure Bulletin, vol. 36, No. 3, pp. 229-231 (Mar. 1993).
IBM Technical Disclosure Bulletin, vol. 34, No. 8, pp. 401-404 (Jan. 1992).

Affiliated with

Also associated with

Rating

Apparatus and method for removing known good die using hot shear does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for removing known good die using hot shear, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for removing known good die using hot shear will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-759485