Apparatus and method for removing known good die using hot shear

Details Apparatus and method for removing known good die using hot shear Apparatus and method for removing known good die using hot shear

1996-10-18

1998-04-14

Heinrich, Samuel M.

Metal fusion bonding

With means to cut or separate work, filler, flux, or product

228 447, 228 19, B23K 300

Patent

active

057382670

ABSTRACT:
Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.

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