Metal fusion bonding – Process of disassembling bonded surfaces – per se
Patent
1996-04-23
1998-01-13
Heinrich, Samuel M.
Metal fusion bonding
Process of disassembling bonded surfaces, per se
228212, H05K 330, B23K 1018
Patent
active
057070008
ABSTRACT:
Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.
REFERENCES:
patent: 3834605 (1974-09-01), Coffin
patent: 4360142 (1982-11-01), Carpenter et al.
patent: 4360960 (1982-11-01), Patel
patent: 4526859 (1985-07-01), Christensen et al.
patent: 4561584 (1985-12-01), Hug
patent: 4637542 (1987-01-01), Breske et al.
patent: 4740099 (1988-04-01), Philipoussi
patent: 4767047 (1988-08-01), Todd et al.
patent: 4894910 (1990-01-01), Reimer et al.
patent: 4962878 (1990-10-01), Kent
patent: 5007163 (1991-04-01), Pope et al.
patent: 5170930 (1992-12-01), Dolbear et al.
patent: 5173451 (1992-12-01), Kinsman et al.
patent: 5198066 (1993-03-01), Cederstrom
patent: 5219520 (1993-06-01), Borfman et al.
patent: 5237269 (1993-08-01), Aimi et al.
patent: 5284286 (1994-02-01), Brofman et al.
patent: 5556024 (1996-09-01), Olson et al.
IBM Technical Disclosure Bulletin, vol. 35, No. 4A, pp. 25-27 (Sep. 1992).
IBM Technical Disclosure Bulletin, vol. 29, No. 6, pp. 2784-285 (Nov. 1986).
IBM Technical Disclosure Bulletin, vol. 32, No. 10A, p. 195 (Mar. 1990).
IBM Technical Disclosure Bulletin, vol. 36, No. 3, pp. 229-231 (Mar. 1993).
IBM Technical Disclosure Bulletin, vol. 34, No. 8, pp. 401-404 (Jan. 1992).
Research Disclosure, "Novel Solder Array Mmodule Rework/Tool", Kenneth Mason Publications Ltd, England, No. 330, Oct. 1991.
IBM Tecnical Disclosure Bulletin, Chip with Lengthened Solder Joints Using Shape Memory Alloy, vol. 29 No. 12, May 1987.
IBM Technical Disclosure Bulletin, Multilayer Substrate Repair Method, Mol. 16, No. 9, pp. 2789,2790, Feb. 1974.
IBM Technical Disclosure Bulletin, Interposer Remove Tool, vol. 35, No. 4A, pp. 25-27, Sep. 1992.
Olson David Charles
Phillips, III Robert
Ahsan Aziz M.
Heinrich Samuel M.
International Business Machines - Corporation
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