Apparatus and method for removal of heat from packaged element

Details Apparatus and method for removal of heat from packaged element Apparatus and method for removal of heat from packaged element

1988-01-12

1989-01-31

Scott, Samuel

Heat exchange

Heat transmitter

165 804, 361387, 361386, 357 81, 174 163, F28F 1314, H01L 2340

Patent

active

048009563

ABSTRACT:
In order to provide thermal coupling of a package, particularly a package containing electronic components, and a heat sink, a thermal transfer assembly includes a first assembly having a group of generally parallel cooling fins coupled to the package. Coupled to the heat sink, such as cooling plate, is a second assembly also including a plurality of generally parallel cooling fins. The second set of cooling fins is positioned on the heat sink so that when the heat sink is in a predetermined position with respect to the package, the cooling fins overlap. The overlapping cooling fins permit efficient transfer of heat thus permitting heat generated in the package to be conveyed to the heat sink. The overlapping fins also permit convenient disassembly and reassembly for test and maintenance procedures. Techniques for fabrication of the thermal transfer assembly are described along with procedures for improving the operation of the heat transfer assembly. Parameters optimizing the performance of thermal transfer assembly are discussed. The individual components of the thermal transfer unit can be used separately as heat exchange units.

REFERENCES:
patent: 4226281 (1980-10-01), Chu
patent: 4254431 (1981-03-01), Babuka et al.
patent: 4381032 (1983-04-01), Clutchaw
patent: 4384610 (1983-05-01), Cook et al.
patent: 4498530 (1985-02-01), Lipschutz
patent: 4587594 (1986-05-01), McPherson

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