Apparatus and method for reducing wallboard waste during...

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control

Reexamination Certificate

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Details

C156S361000, C156S502000, C156S504000

Reexamination Certificate

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06868883

ABSTRACT:
An apparatus and method for reducing the amount of wallboard wasted during the manufacturing process is disclosed. Wallboard sections that contain a cover paper splice, which sections must go to waste, are reduced in size during the manufacturing process. This is accomplished by determining the optimum location for a cover paper splice to be made and making the splice at or near this location, such that a rotary knife can readily isolate the splice onto a section of wallboard having a reduce length. This function is accomplished using any suitable computer equipment capable of monitoring desired manufacturing conditions and using this data to calculate the optimum location for a splice.

REFERENCES:
patent: 4512225 (1985-04-01), Green
patent: 5190234 (1993-03-01), Ezekiel
patent: 5388387 (1995-02-01), McElvy
patent: 5437749 (1995-08-01), Pipkorn et al.
patent: 5443681 (1995-08-01), Stivani et al.
patent: 5718797 (1998-02-01), Phillips et al.
patent: 5879446 (1999-03-01), Patel et al.

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