Apparatus and method for reducing substrate warpage

Details Apparatus and method for reducing substrate warpage Apparatus and method for reducing substrate warpage

2006-01-24

2006-01-24

Davis, Robert B. (Department: 1722)

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Female mold type means

C294S106000, C414S226020, C414S753100, C414S941000

Reexamination Certificate

active

06988879

ABSTRACT:
The invention provides an apparatus and method for reducing warpage of a substrate undergoing a molding process, comprising a conveying device for transporting the substrate during molding and pressure means adapted to act on the substrate whereby to maintain the flatness of the substrate. Using the invention, it is possible to provide an apparatus and method which are usable with conventional substrates and which reduce reliance on material formulation to maintain flatness of the substrate.

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