Apparatus and method for reducing removal forces for CMP pads

Abrading – Machine – Rotary tool

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Details

451527, 451538, 451550, 451288, 451290, B24B 2900

Patent

active

060365862

ABSTRACT:
An improvement in a polishing apparatus for planarizing substrates comprises a tenacious coating of a low-adhesion material to the platen surface. An expendable polishing pad is adhesively attached to the low-adhesion material, and may be removed for periodic replacement at much reduced expenditure of force. Polishing pads joined to low-adhesion materials such as polytetrafluoroethylene (PTFE) by conventional adhesives resist distortion during polishing but are readily removed for replacement.

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