Apparatus and method for reducing damage to wafer cutting blades

Details Apparatus and method for reducing damage to wafer cutting blades Apparatus and method for reducing damage to wafer cutting blades

1997-10-07

1999-09-14

Eley, Timothy V.

Stone working

Work supports

125 12, 451 41, B28D 704

Patent

active

059506130

ABSTRACT:
A wafer cutting chuck for reducing wear and damage to a cutting blade. The chuck has a surface for supporting a wafer. The chuck also has a plurality of recesses in its surface to accommodate a cutting blade of a wafer spindle and blade assembly. The recesses are at least as wide as the cutting blade and they correspond to street indices on the wafer.
Preferably, the chuck is constructed of a metal, a ceramic, or silicon. In a most preferred embodiment of the present invention, the recesses include ports which are connected to a vacuum pump. The ports allow a vacuum, created by the vacuum pump, to pull an adhesive tape from the wafer, so that the cutting blade of the wafer spindle and blade assembly does not contact the adhesive tape.

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