Apparatus and method for rapid thermal processing

Details Apparatus and method for rapid thermal processing Apparatus and method for rapid thermal processing

1996-04-12

1998-11-17

Dutton, Brian

Fishing, trapping, and vermin destroying

118724, 219390, 392416, 392418, 432253, H01L 21324, H01L 21477, C23C 1600, A21B 200

Patent

active

058375554

ABSTRACT:
A closable enclosure for rapid thermal processing of semiconductor wafers is presented, wherein the closable enclosure has an enclosed volume less than 10 times the volume of the wafer, and wherein the closable enclosure may closed about the wafer while the closable enclosure is surrounded by the process gas.

REFERENCES:
patent: 3713900 (1973-01-01), Suzuki
patent: 4312681 (1982-01-01), Rupprecht et al.
patent: 4365588 (1982-12-01), Jolly
patent: 4794217 (1988-12-01), Quan et al.
patent: 4978567 (1990-12-01), Miller
patent: 5011794 (1991-04-01), Grim et al.
patent: 5308161 (1994-05-01), Stein
Goff et al, "Elimination of slip lines in capless RTA of GaAs", J. Mat. Res. 3, 911-913 (1988).
Pearton et al, "High temperature degradation free RTA of GaAs and InP", SPIE 1393, 150-160, (1990).

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