Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent
1994-08-05
1996-06-04
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
257778, H01L 2310
Patent
active
055236286
ABSTRACT:
A method and apparatus for protecting metal bumped chips during processing and for providing mechanical support to interconnected chips. A protective adhesive stop is affixed to a metal bumped chip so that the height of the stop is at least as high as the metal bump. The stop protects the metal bump during routine handling. When the chip is interconnected to another bumped chip by cold welding their respective metal bumps, the stop contacts the face of the second chip and provides mechanical support. The stop is preferably a thermoplastic that is heated to adhere it to the second chip. The addition of the protective stop facilitates automated processing of metal bumped chips, and provides stronger, faster, and lower power chips.
REFERENCES:
patent: 3811186 (1974-05-01), Larnerd et al.
patent: 4878611 (1989-11-01), Lo Vasco et al.
patent: 5214308 (1993-05-01), Nishiguchi et al.
patent: 5220200 (1993-06-01), Blanton
Tyra Joe B.
Williams Ronald L.
Denson-Low W. K.
Hardy David
Hille Rolf
Hughes Aircraft Company
Schubert W. C.
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