Apparatus and method for producing substrate with electrical...

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

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C451S287000, C438S690000

Reexamination Certificate

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06855035

ABSTRACT:
The apparatus and method for producing a substrate having a substrate surface by polishing the substrate surface, which includes a metallic wire.A polishing liquid is supplied a clearance between the substrate surface and the surface of a polishing pad. The polishing liquid includes an acid which dissolves the oxidized part of the substrate surface and is substantially free of solid abrasive powder.A relative movement is generated between the substrate surface and the polishing pad surface while the substrate surface is pressed against the polishing pad surface while the polishing liquid is supplied so that the dissolved oxidized part of the substrate surface can be removed from the substrate.

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“A New Slurry-free CMP Technique for Cu Interconnects Published on Semi-Technology Symposium”, 1998.

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